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Frequently Asked Questions

Your Questions Answered: Common Inquiries About PCB Design, Manufacturing, and Industry Practices

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  • PCB Layout Design
    High Layer Count PCB Mixed-Signal Design High-Speed Design Micro-BGA and BGA Matched Length Traces Embedded Resistor COB Rigid Flex Design RF Design Blind, Buried, and Micro Via High-Power Circuit Design High-Density Design Controlled Impedance for Single Ended and Differential EMI/EMC Compliance HDI Technology Flex Design MCM
  • PCB Fabrication
    Rigid, Flex, Rigid-Flex Up to 50 Layers Board thickness 0.25 ~ 3.20mm Aspect Ratio 30:1 Laminates - Roger, Nelco, Arlon, Isola, Sheng Yi, Doosan, ITEQ, Taconic, TUC, Megatron, ThinFlex, Dupont Min. via (mech) 6mils, min. via (laser) 4mils Via in pad (plated shut), Blind/Buried Via Edge plating (half-hole) Impedance control up to ± 5% Soldermask registration 2mils (min) Electrical Test (jig/flying-probe), Solderability Test (IR Reflow), Thermal Stress Test (288°C), Micro-Section Analysis, Ionic Contamination Test, Hi-Pot Test, TDR Measurement, SM/SS Peeling Test Prototype, NPI, HMLV build Board size 24” x 31” max Copper Thickness up ⅓ ~ 6oz Type of PCB - FR4, High-Tg FR4, Halogen-Free, High Temp PCB, Aluminium PCB, PI, Telfon, Hybrid Min. trace width/gap 3/3mils Via plugging/filling (non-conductive, conductive) Back-drill depth tolerance 8mil (min) HDI up to 4+4+4, ALIVH (Any-Layer) HASL, LF-HASL, ENIG, Immersion Silver/Tin, ENEPIG, OSP/Entek, Hard/Flash/Electrolytic Gold, Soft Bondable Gold, Carbon Soldermask green, red, blue, black, purple, orange, yellow Country of Manufacturer – Taiwan, Korea, China, Vietnam, Singapore, USA
  • Component Sourcing
    Cut Tape/ Loose Form Avnet, Arrow, Future, Direct Manufacturing, Etc. Prototype/ NPI Full BOM Productions Lead Time Buy (back-order stock available) Online Component Stockists Reel Tape/ Tube/ Tray Form Element 14, Digikey, Mouser, Etc. High-Mix Low Volume Stock Buy (online stock available) Authorised Component Distributors Certificate of Conformance (CoC) available
  • Assembly
    Rigid , Flex, Rigid-Flex SMT IR Reflow (up to 9+2 zones) Manual Hand-Soldering Pick & Place 0201 case size BGA Rework/Reballing Automated Optical Inspection Board Size 50x50 ~ 420x380mm Functional Circuit Testing (FCT) Prototype /NPI Production QFP, QFN, BGA, CSP, Fine Pitch Manual Hand Soldering Process Prototype, NPI, HMLV volume build SMT Vapor-Phase Soldering Wave Soldering Lead(Pb)-Free Compliant Stencil Laser Cut/E-Form Min BGA Pitch 0.4mm 2D X-Ray Imaging Inspection Country of Manufacturer - Singapore, Malaysia, Korea High-Mix, Low-Vol Production SMT Reflow Lead-Free Process Ball Grid Array (BGA) Rework
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